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Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board

Heavy Copper 3oz Power PCB Board Back Drilling Drone ESC Motor Drive Board

Brand Name: XSW PCB
Model Number: XSW-PWR3
MOQ: 1 Piece
Price: Negotiable
Payment Terms: T/T, Western Union, PayPal
Supply Ability: 1 Million Square Feet per Month
Detail Information
Place of Origin:
China
Certification:
UL, ISO9001
Layer Count:
4-Layer Heavy Copper
Material:
FR-4 High-Tg 170
Board Thickness:
1.6 Mm (Customizable)
Outer / Inner Copper:
3 Oz / 2 Oz
Min Line Width / Spacing:
0.15 Mm / 0.15 Mm
Back Drilling Stub:
< 0.2 Mm
Thermal Vias:
Copper-filled Arrays
Solder Mask Color:
Green
Surface Finish:
HASL Lead-Free
Packaging Details:
Anti-static bag with desiccant, vacuum-packed, export-grade corrugated carton
Supply Ability:
1 Million Square Feet per Month
Highlight:

Heavy Copper 3oz Power PCB

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Back Drilling Power Board Fabrication

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Drone ESC Motor Drive PCB

Product Description

Heavy Copper 3oz Power PCB Board with Back Drilling for Drone ESC Motor Drive

This heavy copper power PCB is purpose-built for drone electronic speed controllers (ESC), motor drivers and battery management boards. Featuring 3 oz outer copper, 2 oz inner copper and depth-controlled back drilling, it delivers the high current carrying capability and low thermal resistance demanded by high-power UAV propulsion systems.

Key Specifications

Layer Count4-Layer (heavy copper power stack-up)
MaterialFR-4 High-Tg 170
Board Thickness1.6 mm (Customizable 1.0-3.2 mm)
Outer / Inner Copper3 oz / 2 oz (up to 6 oz on request)
Min Line Width / Spacing0.15 mm / 0.15 mm
Back DrillingDepth-controlled, stub length < 0.2 mm
Thermal ViasCopper-filled thermal via arrays
Solder MaskGreen
Surface FinishHASL Lead-Free

Production Technical Difficulties We Solve

1. Heavy Copper Plating Uniformity

3 oz copper is electroplated with consistent thickness across the whole panel, using optimized shield and current density to avoid over-plating and under-plating that cause uneven current paths.

2. Thick Copper Etching Control

Etching 3 oz copper demands tight side-etch control to protect fine features and minimize undercut, keeping trace width within tolerance for predictable current rating.

3. Depth-Controlled Back Drilling

Back drilling removes via stubs to a controlled depth (< 0.2 mm stub) with high positional accuracy, reducing signal reflection and preventing copper burrs inside the via barrels.

4. Thermal Management

Copper-filled thermal vias and heavy copper planes are combined to pull heat away from power MOSFETs, keeping ESC junction temperatures under control during aggressive throttle.

5. Solder Mask over High-Topography Copper

Uniform solder mask coating is achieved over the raised heavy copper surface, preventing mask skip, bubbles and exposed copper that lead to short risks during assembly.

Why It Performs Under Load

ApplicationDrone ESC, brushless motor driver, BMS and power distribution boards
Current CapabilityDesigned for high-current propulsion and power conversion circuits
Assembly ServiceSMT assembly with high-mass soldering and selective solder available
TestingFlying probe, thermal cycling, AOI and 100% electrical test
Share your current, thermal and Gerber requirements and our engineering team will confirm the stack-up and quotation within 24 hours.