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Drone PCB Board
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Custom Drone Receiver Circuit Board PCB Electronic Board One Stop SMT PCB Assembly

Custom Drone Receiver Circuit Board PCB Electronic Board One Stop SMT PCB Assembly

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
4-Layer
Material:
FR-4 TG170
Board Thickness:
1.0 Mm (Customizable)
Copper Thickness:
1/1/1/1 Oz
Surface Finish:
Black
Supply Ability:
1 Million Square feet/per month
Highlight:

Custom Drone Receiver Circuit Board

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Drone PCB Electronic Board

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One Stop SMT PCB Assembly

Product Description

Drone receiver board One stop custom PCB Electronic Boards SMT Assembly PCBA manufacturer

 

The Drone Receiver Board One Stop Custom PCB Electronic Boards SMT Assembly PCBA Service is designed for UAV communication systems, remote-control receivers, flight control modules, telemetry systems, and smart drone applications. As a complete PCB and PCBA manufacturing solution, it covers PCB fabrication, component sourcing, SMT assembly, DIP assembly, testing, and final product integration.

 

Key Specifications
Layer Count 4-Layer
Material FR-4 TG170
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Black
Surface Finish   Lead-free soldering

 

Product Description

  • One-Stop PCB & PCBA Manufacturing
    • Complete service including PCB fabrication, component procurement, SMT assembly, testing, and packaging.
    • Simplifies supply chain management and reduces production lead time.
  • Designed for Drone Receiver Applications
    • Suitable for RF receiver modules, telemetry systems, flight controllers, and UAV communication devices.
    • Supports stable wireless signal transmission and reception.
  • Advanced SMT Assembly Technology
    • High-speed SMT production lines ensure accurate component placement.
    • Compatible with fine-pitch ICs, BGA, QFN, and miniature electronic components.
  • Excellent Signal Integrity
    • Optimized PCB layout minimizes signal loss and electromagnetic interference.
    • Enhances communication reliability in complex operating environments.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm