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6 Layer Heavy Copper Power PCB Assembly For Industrial Automation

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

Material:

FR4 TG170

Board Thickness:

3.0 Mm

Copper Thickness:

3/1/1/1/1/3 Oz

Minimum Hole Size:

0.235mm

Minimum Line Width:

0.2mm

Minimum Line Spacing:

0.2 Mm

Supply Ability:

1 Million Square feet/per month

Highlight:

Heavy Copper Power PCB

6 Layer Power PCB

Industrial Automation Power PCB Assembly

Product Description

6-Layer Green Solder Mask 3OZ Heavy Copper Industrial Automation Power PCB

The 6-layer green solder mask 3OZ heavy copper industrial automation power PCB requires: increased line width and spacing with optimized thermal management in design; controlled etching and solder mask processes in manufacturing; and enhanced heat dissipation, current verification, and vibration protection in application.

Key Specifications

Layer Count	6
Material	FR4 TG170
Board Thickness	3.0 mm
Copper Thickness	3/1/1/1/1/3 oz
Minimum Hole Size	0.235mm
Minimum Line Width	0.2mm
Minimum Line Spacing	0.2 mm
Solder Mask Color	Green
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Application Field	High Current Power Supply

Product Features

6-layer design with increased copper thickness to meet high-current operation requirements
3OZ copper foil thickness enables simultaneous handling of multiple high-current groups
Comprehensive quality control with rigorous copper thickness inspection and electrical testing
Industrial-grade reliability engineered for harsh industrial environments

Industrial PCB Solutions
We provide one-stop PCB solutions tailored for the industrial automation field, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptability to meet long-term stable operation requirements.

Advantages of Custom PCB Solutions

Fully Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and strong anti-interference performance, ensuring stable operation even in harsh environments
Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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