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OSP Single Layer Printed Circuit Board FR-4 White Solder Mask PCB For Display Backlight

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

1-Layer

Material:

FR-4

Board Thickness:

0.2 Mm (Customizable)

Copper Thickness:

0.5 Oz

Surface Finish:

OSP

Supply Ability:

1 Million Square feet/per month

Highlight:

OSP Single Layer Printed Circuit Board

Single Layer Printed Circuit Board FR-4

Display Backlight White Solder Mask PCB

Product Description

Single Layer Printed Circuit Board with White Solder Mask 0.2mm FR-4 PCB Board with OSP for Display Backlight

This single-layer FR-4 PCB features 0.2mm finished thickness, white solder mask and OSP surface finish, specially manufactured for display backlight driver assemblies. The lightweight thin FR4 substrate meets the ultra-thin structural requirements of backlight modules. White solder mask offers high reflectivity to improve light utilization efficiency of LED backlights. OSP treatment provides good solderability for LED chips and passive components with cost-effective advantages. Stable insulation performance and reliable circuit etching ensure consistent current transmission for backlight circuits. Widely used in LCD screens, tablet displays, monitor backlight strips, notebook panel backlight modules and small-size display lighting units.

Key Specifications

Layer Count	1-Layer
Material	FR-4
Board Thickness	0.2 mm (Customizable)
Copper Thickness	0.5 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	White
Surface Finish	OSP

Product Description

Single layer PCB construction, finished board thickness: 0.2mm, ultra-thin and lightweight
FR-4 base material, excellent electrical insulation and good dimensional stability
White solder mask, high light reflectivity, enhance LED backlight luminous efficiency
OSP organic solderability preservative surface treatment, economical and eco-friendly
Precise circuit etching, uniform trace width for stable LED current output
Flexible ultra-thin board design, suitable for narrow space backlight module assembly
Good heat dissipation performance for low-power LED backlight circuits
Low water absorption, stable performance in normal display working temperature
Support customized circuit pattern, panel size and routing according to drawings
Cost-effective solution for mass production of display backlight units

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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