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Single Layer Printed Circuit Board
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Immersion Gold Single Layer PCB Fabrication 0.6mm Fast Prototype PCB Board

Immersion Gold Single Layer PCB Fabrication 0.6mm Fast Prototype PCB Board

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
1-Layer
Material:
FR-4
Board Thickness:
0.6 Mm (Customizable)
Copper Thickness:
0.5 Oz
Surface Finish:
Immersion Gold
Supply Ability:
1 Million Square feet/per month
Highlight:

Single Layer Fast Prototype PCB

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Immersion Gold Single Layer PCB Fabrication

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Single Layer PCB Fabrication 0.6mm

Product Description

Immersion Gold Fast Prototype PCB Fabrication Single Layer 0.8mm

A ​​Single-Layer PCB (Single-Sided PCB)​​ is the simplest type of printed circuit board, consisting of ​​only one conductive copper layer​​ laminated onto a non-conductive substrate (usually FR4).

 

Key Features:​​

✔ ​​1 Conductive Layer​​ – All components and traces are on ​​one side​​ of the board.
✔ ​​Simple Design​​ – Ideal for low-complexity circuits.
✔ ​​Cost-Effective​​ – Cheaper to manufacture than multi-layer PCBs.
✔ ​​Easy to Fabricate​​ – Faster production due to fewer layers.

 

Key Specifications
Layer Count 1-Layer
Material FR-4
Board Thickness 0.6 mm (Customizable)
Copper Thickness 0.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   Immersion Gold

 

Product Description

Single-Layer PCB Design

  • Cost-effective solution for simple circuit applications.
  • Easy layout design and manufacturing process.
  • Suitable for consumer electronics, LED modules, and industrial control circuits.

Ultra-Thin 0.6mm Board Thickness

  • Compact and lightweight PCB construction.
  • Ideal for space-constrained electronic devices.
  • Supports miniaturized product designs.

Premium Immersion Gold (ENIG) Surface Finish

  • Excellent solderability for SMT and through-hole assembly.
  • Superior oxidation and corrosion resistance.
  • Flat and uniform surface for fine-pitch components.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm