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Radio Frequency PCB
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Rogers RO4350B Radio High Frequency PCB RF PCB Design Surface Mount PTFE Based

Rogers RO4350B Radio High Frequency PCB RF PCB Design Surface Mount PTFE Based

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
8-Layer
Material:
Rogers RO4350B
Board Thickness:
1.0 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

Radio High Frequency PCB

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Rogers RO4350B High Frequency PCB

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RO4350B RF PCB Design

Product Description

Rogers RO4350B Radio High Frequency PCB RFPCB Surface Mount PTFE based

 

Rogers RO4350B Radio High Frequency PCB RFPCB Surface Mount PTFE-Based is a high-performance RF printed circuit board specifically designed for radio frequency, microwave, wireless communication, radar, and high-speed electronic applications. Manufactured using Rogers RO4350B high-frequency laminate, this RF PCB combines low dielectric loss, excellent dimensional stability, and superior thermal performance to deliver reliable signal transmission across a wide frequency range.

 

Key Specifications
Layer Count 8-Layer
Material Rogers RO4350B
Board Thickness 1 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

Premium Rogers RO4350B High-Frequency Material

  • Rogers RO4350B laminate for RF and microwave applications.
  • Dielectric constant (Dk) approximately 3.48.
  • Stable electrical performance over a wide frequency range.

PTFE-Based RF Performance

  • Delivers low-loss characteristics similar to PTFE materials.
  • Excellent signal transmission efficiency.
  • Ideal for high-frequency and high-speed designs.

Low Dissipation Factor

  • Minimizes signal attenuation and insertion loss.
  • Improves RF system performance.
  • Suitable for microwave and millimeter-wave applications.

Excellent Signal Integrity

  • Supports controlled impedance circuit designs.
  • Reduces signal distortion and phase variation.
  • Ensures reliable high-frequency communication.

Surface Mount Technology (SMT) Compatible

  • Optimized for automated SMT assembly.
  • Supports fine-pitch and high-density components.
  • Improves assembly efficiency and product reliability.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm