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Radio Frequency PCB
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Radio Frequency Surface Mount Telecom PCB Assembly 2.0mm Board Thickness

Radio Frequency Surface Mount Telecom PCB Assembly 2.0mm Board Thickness

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
6-Layer
Material:
FR-4
Board Thickness:
2.0 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1 Oz
Surface Finish:
Lead-free Soldering
Supply Ability:
1 Million Square feet/per month
Highlight:

Radio Frequency Surface Mount PCB Assembly

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Telecom PCB Assembly 2.0mm

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Radio Frequency Telecom PCB Assembly

Product Description

Radio Frequency Surface Mount Telecom PCB Assembly 2.0mm Board Thickness

 

The Radio Frequency (RF) Surface Mount Telecom PCB Assembly 2.0mm ODM is a high-performance PCB and PCBA solution specifically designed for RF communication systems, telecom infrastructure, wireless networking equipment, and 5G communication devices. Manufactured with a robust 2.0mm PCB thickness, this assembly offers excellent mechanical stability, controlled impedance performance, and superior signal integrity for high-frequency applications

 

Key Specifications
Layer Count 6-Layer
Material FR-4
Board Thickness 2.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   Lead-free soldering

 

Product Description

  • Optimized for RF & Telecom Applications
    • Designed for high-frequency wireless communication systems and telecom equipment.
    • Suitable for 4G LTE, 5G, IoT, satellite communication, and RF transmission devices.
  • 2.0mm Heavy-Duty PCB Construction
    • Provides enhanced mechanical strength and dimensional stability.
    • Improves durability for telecom and outdoor communication equipment.
  • Advanced Surface Mount Technology (SMT) Assembly
    • Supports fine-pitch ICs, BGA, QFN, RF modules, and miniature passive components.
    • Ensures precise placement and consistent assembly quality.
  • Excellent Signal Integrity
    • Controlled impedance routing minimizes signal reflection and transmission loss.
    • Supports high-speed and high-frequency signal processing.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm