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Radio Frequency PCB
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Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
4-Layer
Material:
FR4
Board Thickness:
1.2 Mm (Customizable)
Copper Thickness:
1/1/1/1 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

Communication Immersion Gold PCB

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Multilayer Microwave PCB Board

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Multilayer RF PCB Board

Product Description

Immersion Gold PCB Multilayer PCB Circuit Microwave Radio Frequency Communication Board

 

The Immersion Gold Multilayer PCB Circuit Board is specifically designed for microwave, radio frequency (RF), and high-speed communication applications. Manufactured using advanced multilayer PCB technology and premium high-frequency materials, this board delivers excellent signal integrity, low transmission loss, and superior electromagnetic compatibility for demanding wireless communication systems.

 

Key Specifications
Layer Count 4-Layer
Material FR4
Board Thickness 1.2 mm (Customizable)
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

  • Optimized for Microwave & RF Applications
    • Designed for high-frequency signal transmission and microwave communication systems.
    • Suitable for RF circuits operating in demanding communication environments.
  • Multilayer PCB Construction
    • Supports complex signal routing and high-density circuit layouts.
    • Dedicated power and ground planes improve signal stability and EMI suppression.
  • ENIG (Immersion Gold) Surface Finish
    • Provides excellent solderability and flat surface characteristics.
    • Enhances corrosion resistance and long-term electrical reliability.
  • Excellent Signal Integrity
    • Controlled impedance design minimizes signal reflection and transmission loss.
    • Supports high-speed and high-frequency communication protocols.
  • Low Insertion Loss
    • High-frequency material options reduce attenuation in RF and microwave circuits.
    • Improves overall communication efficiency.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm