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Copper Substrate PCB
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1 Layer Copper Substrate PCB PCBA Service 0.8mm High Thermal Conductivity

1 Layer Copper Substrate PCB PCBA Service 0.8mm High Thermal Conductivity

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
1-Layer
Material:
Copper
Board Thickness:
0.8mm (Customizable)
Copper Thickness:
1 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

1 Layer Copper Substrate PCB

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Copper Substrate PCB 0.8mm

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PCBA Service High Thermal Conductivity

Product Description

PCB PCBA Service High Thermal Conductivity Copper Substrate PCB

 

High Thermal Conductivity Copper Substrate PCB is a professional metal core printed circuit board (MCPCB) customized for high-power heat dissipation scenarios. It adopts high-performance copper base as the core heat-conducting substrate, combined with reliable circuit fabrication, surface finishing and assembly processes to provide integrated PCB & PCBA one-stop services. This copper base PCB efficiently transfers heat generated by power chips, LEDs and power components outward, effectively solving overheating failures of high-power electronic equipment, widely applied in new energy, automotive electronics, high-power lighting, power supply and industrial control fields. Our full PCBA service covers PCB manufacturing, component procurement, SMT soldering, DIP assembly, function testing and finished product packaging, delivering ready-to-use circuit assemblies to customers.

 

Key Specifications
Layer Count 1-Layer
Material Copper 
Board Thickness 0.8 mm (Customizable)
Copper Thickness 1 oz
Minimum Hole Size 0.15 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color White
Surface Finish   ENIG

 

Product Description

  • High Power Handling Capability
    • Supports high-current and high-power applications.
    • Ideal for power conversion, motor control, and industrial electronic systems.
  • Enhanced Reliability
    • Efficient thermal management minimizes thermal stress on components.
    • Improves product lifespan and long-term operational stability.
  • Superior Mechanical Strength
    • Copper core structure offers excellent rigidity and durability.
    • Resistant to vibration, shock, and harsh operating environments.
  • Optimized Thermal Management Design
    • Reduces hot spots and improves heat distribution across the PCB.
    • Suitable for applications requiring continuous high-load operation.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm