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Copper Substrate PCB
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High Current Carrying Copper Substrate PCB Single Layer 0.4mm Thickness

High Current Carrying Copper Substrate PCB Single Layer 0.4mm Thickness

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
1-Layer
Material:
Copper Core
Board Thickness:
0.4 Mm (Customizable)
Copper Thickness:
1 Oz
Surface Finish:
OSP
Supply Ability:
1 Million Square feet/per month
Highlight:

Copper Substrate PCB 0.4mm

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Copper Substrate PCB Single Layer

Product Description

High Thermal Conductivity and High Current Carrying Copper Substrate High Demanding PCB Support

 

The High Thermal Conductivity and High Current Carrying Copper Substrate PCB is specifically engineered for high-power electronic systems that require exceptional heat dissipation and superior current-carrying capability. Utilizing a solid copper substrate and heavy copper circuitry, this PCB provides outstanding thermal management, electrical conductivity, and mechanical strength for demanding industrial, automotive, energy, and telecommunications applications.

Designed to support high-power components, power conversion circuits, and high-current pathways, the copper substrate PCB efficiently transfers heat away from critical devices, reducing operating temperatures and enhancing system reliability. Its robust construction and excellent thermal performance make it an ideal solution for applications where conventional FR4 PCBs cannot meet thermal or electrical requirements.

 

Key Specifications
Layer Count 1-Layer
Material Copper Core
Board Thickness 0.4 mm (Customizable)
Copper Thickness 1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color White
Surface Finish   OSP

 

Product Description

  • Exceptional Thermal Conductivity
    • Copper substrate offers significantly higher thermal conductivity than standard FR4 materials.
    • Rapid heat transfer improves system efficiency and component lifespan.
  • High Current Carrying Capability
    • Supports heavy copper traces and high-current circuit designs.
    • Suitable for power electronics, motor drives, and energy conversion systems.
  • Superior Heat Dissipation
    • Effectively reduces thermal buildup around power semiconductors and critical components.
    • Minimizes performance degradation caused by excessive temperatures.
  • Outstanding Mechanical Strength
    • Solid copper base provides excellent rigidity and structural durability.
    • Resistant to vibration, impact, and harsh operating conditions.
  • Enhanced Reliability
    • Reduces thermal stress on solder joints and electronic components.
    • Improves long-term operational stability in demanding environments.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm