|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Layer Count | 4 |
| Material | FR4 |
| Board Thickness | 1.0mm |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.25 mm three sides |
| Minimum Line Width | 0.15 mm |
| Minimum Line Spacing | 0.15 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Security Products |
Product Description:
ENIG Quality: Control the gold layer thickness (0.05~0.1μm) and prevent black pad — these are the foundation of solder joint reliability. Substrate Selection: Use high-Tg, low moisture absorption materials to ensure stability in high-temperature and high-humidity environments. Environmental Adaptability: Consider temperature cycling, salt spray, vibration, and other actual working conditions of security equipment. Testability: Reserve test points to facilitate ICT/FCT inspection. Process Control: Conduct batch sampling inspection for ENIG thickness, solderability, etc.
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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