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| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Layer Count | 6 Layers |
| Material | FR4 |
| Board Thickness | 1.8mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-Free HASL (Tin Spray) |
| Application Field |
Industrial Control and Automation Systems |
We supply high-reliability 6-layer multilayer PCBA prototype and low-to-medium volume assembly solutions specially designed for aerospace applications. Our aerospace-grade 6-layer printed circuit boards adopt high-performance base materials, controlled impedance design, precise blind/buried vias technology and strict manufacturing procedures to withstand harsh operating environments including wide temperature fluctuation, vibration and low air pressure.
We provide full turnkey service covering PCB fabrication, high-grade component sourcing, precision SMT assembly, BGA soldering, reliability testing and dimensional verification. All production follows rigorous IPC aerospace standards, supporting strict traceability requirements. These 6-layer aerospace PCBs are widely used in satellite modules, aviation control systems, airborne communication equipment, flight sensor units and aerospace testing instruments. Prototype validation, engineering trial runs and formal batch production are available.
1.Professional 6-layer multilayer PCB construction optimized for aerospace high-reliability scenarios
2.Support controlled impedance, microvias, blind and buried via aerospace circuit designs
3.High performance low Dk/Df substrate options, outstanding thermal and mechanical stability
4.Precision PCBA assembly for high-end chips, BGA, QFN and fine-pitch components
5.Complete turnkey service: PCB manufacturing, component procurement, SMT/DIP assembly & functional testing
6.Strict manufacturing compliance with IPC-6012, IPC-A-610 aerospace specifications
7.Excellent resistance to extreme temperature cycling, shock and vibration
8.Full production traceability available to meet aerospace industry audit requirements
9.Multiple high-reliability surface finishes: Hard immersion gold, soft gold, ENEPIG
10.Accept prototype samples, engineering prototypes and small batch aerospace orders
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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