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Optical Module Adapter 2 Layer Printed Circuit Board FR4 TG150 High Frequency Communication PCB

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

2 Layers

Material:

FR4

Board Thickness:

1.6mm

Copper Thickness:

1/1 Oz

Minimum Hole Size:

0.25mm

Minimum Line Width:

0.2mm

Supply Ability:

1 Million Square feet/per month

Highlight:

Adapter 2 Layer Printed Circuit Board

2 Layer Printed Circuit Board FR4 TG150

High Frequency Communication PCB

Product Description

2-layer ENIG Optical Module Adapter Board

Product Overview

High-performance 2-layer ENIG optical module adapter board designed for communication module applications, featuring excellent high-frequency performance and reliability.

Key Specifications

Layer Count	2 Layers
Material	FR4
Board Thickness	1.6mm
Copper Thickness	1/1 oz
Minimum Hole Size	0.25mm
Minimum Line Width	0.2mm
Minimum Line Spacing	0.2mm
Solder Mask Color	Green
Surface Finish	ENIG
Application Field	Communication Module

Critical Production Processes

ENIG Process Control: Nickel layer thickness strictly controlled at 3-6μm with phosphorus content of 6%-9%, and gold layer at 0.05-0.1μm. Precise reaction time management to prevent "black pad" defects.
Pre-treatment Cleanliness: Efficient degreasing and micro-etching (depth 0.5-1.5μm) to ensure fresh copper surface with optimal nickel layer adhesion.
High-speed Signal Transmission: Characteristic impedance deviation controlled within ±8%, precise line width tolerance and etching factor management, with differential pairs maintained equal in length and symmetrical.
Dimensional Accuracy: Profile dimension tolerance controlled within ±0.1mm and hole position accuracy within ±2mil to meet compact assembly requirements.
Quality Verification: Comprehensive solderability testing and environmental reliability verification including high-temperature and high-humidity tests. Storage in dry, sulfur-free environment to prevent gold surface oxidation.

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm