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ENIG Finish Interface 2 Layer PCB Board For Optical Communication Equipment

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

2 Layers

Material:

FR4

Board Thickness:

1.2mm

Copper Thickness:

1/1 Oz

Minimum Hole Size:

0.25mm

Minimum Line Width:

0.2mm

Supply Ability:

1 Million Square feet/per month

Highlight:

ENIG 2 Layer PCB Board

Communication 2 Layer PCB Board

Product Description

2-layer ENIG Optical Communication Equipment Interface Board

This 2-layer ENIG optical communication equipment interface board features advanced manufacturing processes and precise specifications for reliable performance in optical communication applications.

Key Specifications

Layer Count	2 Layers
Material	FR4
Board Thickness	1.2mm
Copper Thickness	1/1 oz
Minimum Hole Size	0.25mm
Minimum Line Width	0.2mm
Minimum Line Spacing	0.2mm
Solder Mask Color	Green
Surface Finish	ENIG
Application Field	Optical Communication Equipment Interface

Critical Production Processes

Pattern transfer on both outer layers uses vacuum lamination technology to ensure tight adhesion between dry film and copper surface, avoiding bubble generation
After etching, AOI (Automated Optical Inspection) is required to screen out defects such as undercuts, pinholes, and shorts
Drilling process uses coated drill bits and backup board structures to reduce hole wall burrs, followed by desmearing treatment
Plasma treatment is performed before electroless copper deposition, followed by backlight test after copper deposition
Solder mask uses CCD screen printer with repeat positioning accuracy of ±15μm to ensure solder mask opening alignment
Before ENIG, pretreatment including degreasing, micro-etching, and activation is required
Nickel bath temperature controlled at 82-88°C, nickel layer thickness of 3-6μm, phosphorus content of 10-12%, and gold layer thickness of 0.05-0.1μm
During ENIG process, nickel bath potential must be monitored online (-1.0V to -1.2V)
After ENIG, tape pull testing, nickel layer cross-section analysis, and solderability testing are required
Final TDR impedance testing (deviation within ±5%) and 100% electrical testing are completed

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm