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Medical Circuit Board
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High Reliability Medical Circuit Board With OSP Coating Blue Solder Resist

High Reliability Medical Circuit Board With OSP Coating Blue Solder Resist

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
4-Layer
Material:
FR-4 TG170
Board Thickness:
1.2mm (Customizable)
Copper Thickness:
2/1/1/2 Oz
Surface Finish:
OSP
Supply Ability:
1 Million Square feet/per month
Highlight:

High Reliability Medical Circuit Board

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OSP Coating Medical Circuit Board

Product Description
High Reliability Medical PCB Board with OSP Coating and Blue Solder Resist

A medical-grade low-temperature OSP (Organic Solderability Preservative) coating is applied with a controlled thickness of 0.25–0.40μm. Micro-etching is maintained between 0.7–1.1μm, while copper surface water-break testing exceeds 35 seconds, ensuring optimal coating adhesion and uniformity. After five simulated reflow cycles, the wetting angle remains ≤20°, demonstrating excellent solderability.

The blue solder mask undergoes complete development verification and achieves a 5B adhesion rating through cross-hatch testing. Following post-curing at 150°C for 65 minutes, the PCB exhibits excellent insulation and environmental resistance.

Key Specifications
Layer Count 4-Layer
Material FR-4 TG170
Board Thickness 1.2 mm (Customizable)
Copper Thickness 2/1/1/2 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.12 mm
Minimum Line Spacing 0.12 mm
Solder Mask Color Blue
Surface Finish   OSP

 

Product Description

Medical-Grade 4-Layer PCB Construction

  • Designed for medical electronics and healthcare equipment.
  • High reliability multilayer PCB architecture.
  • Suitable for critical medical applications.

Precision Inner-Layer Circuit Fabrication

  • Line width tolerance controlled within ±7μm.
  • Etching factor ≥4 for improved conductor definition.
  • Enhanced signal consistency and circuit reliability.

100% AOI Inspection

  • Full Automated Optical Inspection of all inner layers.
  • No open circuits permitted before lamination.
  • Improves production yield and product quality.

Advanced Vacuum Lamination Process

  • Vacuum level controlled at ≤-0.098 MPa.
  • 20-minute pre-press process eliminates voids.
  • Prevents delamination and internal defects.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm