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6 Layer Medical Equipment PCB FR4 TG150 1.6mm Thickness ENIG Printed Circuit Board

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

6 Layers

Material:

FR4 TG150

Board Thickness:

1.2mm

Copper Thickness:

1/1/1/1/1/1 Oz

Minimum Hole Size:

0.25mm

Minimum Line Width:

0.2mm

Supply Ability:

1 Million Square feet/per month

Highlight:

Product Description

6-layer ENIG Medical Equipment Control

6-layer ENIG medical equipment control board designed for high-reliability medical device applications.

Key Specifications

Critical Production Processes

Material and Design Selection

High-Tg (≥150°C) or BT resin materials must be selected to ensure long-term heat resistance and moisture resistance
ENIG surface finish is preferred, with nickel layer thickness of 3-6μm and gold layer thickness of 0.05-0.1μm to avoid "black pad" risk
Trace width/spacing should be controlled at 0.1-0.15mm, with characteristic impedance deviation stricter than ±8%

Key Production Process Controls

Drilling and Hole Metallization: Coated drill bits must be used to reduce hole wall burrs. After desmearing, backlight testing (≥Grade 9) is required to ensure hole walls are free of cracks
Pattern Transfer and Etching: LDI exposure equipment should be used, with line width tolerance of ±10%. After etching, 100% AOI inspection must be performed to screen out undercuts and shorts
Lamination and Flatness: Symmetrical stack-up design is required, with post-lamination warpage ≤0.5% to prevent SMT soldering defects such as insufficient solder or open joints
Solder Mask and Surface Finish: Solder mask ink must be resistant to chemical cleaning (e.g., IPA), with no residue after development. Before ENIG, plasma cleaning must be performed, with ionic contamination ≤1.5μg/cm²

Reliability Verification

Each batch must undergo solderability testing, high-temperature high-humidity testing (85°C/85% RH, 168 hours), and temperature cycling testing (-40°C to 85°C, 100 cycles) to ensure long-term electrical stability in sterile environments

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm