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High Frequency Printed Circuit Board
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1.5oz Rogers RF High Frequency PCB Board Fabrication 8 Layer Customized

1.5oz Rogers RF High Frequency PCB Board Fabrication 8 Layer Customized

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
8-Layer
Material:
Rogers
Board Thickness:
1.5 Mm (Customizable)
Copper Thickness:
1.5/1/1/1/1/1/1/1.5 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

RF High Frequency PCB

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Rogers High Frequency PCB

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PCB Board Fabrication 8 Layer

Product Description

1.5oz Rogers RF High Frequency PCB Board 8 Layer Fabrication Customized

 

1.5oz Rogers RF High Frequency PCB Board 8 Layer Fabrication Customized is a premium multilayer PCB solution engineered for RF, microwave, millimeter-wave, aerospace, defense, satellite communication, and 5G networking applications. Utilizing high-performance Rogers® high-frequency materials combined with a robust 8-layer stack-up and 1.5oz copper thickness, this PCB delivers exceptional signal integrity, low insertion loss, controlled impedance, and superior thermal stability in demanding high-frequency environments.

 

Key Specifications
Layer Count 8-Layer
Material Rogers
Board Thickness 1.5 mm (Customizable)
Copper Thickness 1.5/1/1/1/1/1/1/1.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

Premium Rogers High-Frequency Material

  • Low dielectric constant (Dk) for stable RF performance.
  • Ultra-low dissipation factor (Df) minimizes signal loss.
  • Excellent electrical stability across wide frequency ranges.

Advanced 8-Layer PCB Structure

  • Supports complex RF and high-speed digital circuits.
  • Enhanced routing density and signal isolation.
  • Optimized power and ground plane design.

1.5oz Heavy Copper Construction

  • Improved current-carrying capability.
  • Enhanced thermal management performance.
  • Increased mechanical durability and reliability.

Superior Signal Integrity

  • Reduced insertion loss and signal attenuation.
  • Excellent phase stability for RF applications.
  • Supports high-frequency and high-speed data transmission.

Precision Controlled Impedance

  • Tight impedance tolerance control.
  • Consistent transmission line performance.
  • Suitable for RF antennas, microwave modules, and communication systems.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm