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High Frequency Printed Circuit Board
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24 Layer FR4 High Frequency PCB Board 2.5mm With Immersion Gold Surface

24 Layer FR4 High Frequency PCB Board 2.5mm With Immersion Gold Surface

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
24-Layer
Material:
Fr4
Board Thickness:
2.5 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1 Oz
Surface Finish:
Lead-free Soldering
Supply Ability:
1 Million Square feet/per month
Highlight:

High Frequency PCB Board

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Immersion Gold High Frequency PCB

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24 Layer PCB 2.5mm

Product Description

24 Layer FR4 High Frequency PCB Board 2.5mm Immersion Gold Surface For Mobile

 

This 24-layer FR4 high frequency PCB with 2.5mm overall thickness and immersion gold surface finish is specially designed for mobile communication equipment. It adopts high-Tg low-loss FR4 dielectric material to balance excellent high-frequency signal performance and cost advantage. Rigorous multilayer lamination process ensures stable layer alignment and reliable interlayer conduction. Immersion gold surface delivers flat soldering pads, good oxidation resistance and outstanding bonding performance for IC, RF components and BGA chips. Strict controlled impedance is implemented to maintain signal integrity during high-speed data and RF transmission. Widely used in mobile terminal communication mainboards, communication modules, handheld wireless devices and related mobile electronics.

Key Specifications
Layer Count 24-Layer
Material Fr4
Board Thickness 2.5 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish Lead-free Soldering

 

Product Description

1.24-layer multilayer structure, finished board thickness: 2.5mm, stable mechanical structure
2.High frequency low loss FR4 substrate, suitable for mobile communication high-speed signal transmission
3.Precise layer alignment & advanced lamination technology, minimal interlayer displacement
4.Professional controlled impedance capability, effectively reduce high-frequency signal crosstalk and attenuation
5.Good thermal resistance and high Tg property, withstand multiple SMT reflow processes
6.Stable dimensional stability, less warpage after processing
7.Excellent electrical insulation performance, consistent batch production quality
8.Suitable for assembling BGA, QFN and various miniature communication chips

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm