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High Frequency Printed Circuit Board
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Taconic RF35 High Frequency Printed Circuit Board Custom Multilayer PCB

Taconic RF35 High Frequency Printed Circuit Board Custom Multilayer PCB

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
18-Layer
Material:
Taconic RF-35
Board Thickness:
2.5 Mm (Customizable)
Copper Thickness:
2.5/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/2.5 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

Taconic RF35 High Frequency Printed Circuit Board

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Multi Layer High Frequency Printed Circuit Board

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High Frequency Custom Multilayer PCB

Product Description

Taconic RF35 High Frequency PCB Multilayer Printed Circuit Board Custom

 

Taconic RF35 High Frequency PCB Multilayer Printed Circuit Board Custom is a premium low-loss RF PCB solution designed for high-frequency, microwave, millimeter-wave, and high-speed communication applications. Manufactured using Taconic RF-35 high-frequency laminate, this multilayer PCB delivers excellent electrical stability, low dielectric loss, superior signal integrity, and reliable performance in demanding RF environments.

Taconic RF-35 material features a dielectric constant (Dk) of approximately 3.5 and a low dissipation factor (Df), making it ideal for controlled impedance circuits, RF power amplifiers, antennas, filters, couplers, and wireless communication systems. The stable dielectric properties help minimize signal attenuation, phase distortion, and insertion loss across a wide frequency range.

 

Key Specifications
Layer Count 18-Layer
Material Taconic RF-35
Board Thickness 2.5 mm (Customizable)
Copper Thickness 2.5/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/1/2.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Blue
Surface Finish   ENIG

 

Product Description

Premium Taconic RF-35 High-Frequency Material

  • Dielectric constant (Dk) approximately 3.5.
  • Low dissipation factor for reduced signal loss.
  • Excellent electrical stability at high frequencies.

Outstanding RF Performance

  • Optimized for RF, microwave, and millimeter-wave applications.
  • Low insertion loss and signal attenuation.
  • Improved transmission efficiency.

Superior Signal Integrity

  • Stable impedance characteristics.
  • Reduced crosstalk and electromagnetic interference (EMI).
  • Reliable high-speed signal transmission.

Advanced Multilayer PCB Structure

  • Supports complex multilayer stack-ups.
  • Enhanced routing density and signal isolation.
  • Suitable for compact RF designs.

Controlled Impedance Manufacturing

  • Precise impedance control for RF transmission lines.
  • Consistent electrical performance across production batches.
  • Ideal for antenna and communication systems.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm