products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Multilayer Printed Circuit Board
Created with Pixso.

OEM Electronics Full Turnkey PCB Assembly Black Thick Copper PCB Board For Power Module

OEM Electronics Full Turnkey PCB Assembly Black Thick Copper PCB Board For Power Module

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
16-Layer
Material:
PI
Board Thickness:
1.0 Mm (Customizable)
Copper Thickness:
6/2/2/2/2/2/2/2/2/2/2/2/2/2/2/6 Oz
Surface Finish:
Lead-free Soldering
Supply Ability:
1 Million Square feet/per month
Highlight:

Electronics Full Turnkey PCB Assembly

,

Black Thick Copper PCB Board

,

OEM Full Turnkey PCB Assembly

Product Description

OEM Full Turnkey Black Thick Copper PCB Board Electronics For Power Module

 

OEM Full Turnkey Black Thick Copper PCB Board Electronics for Power Module is a high-power PCB assembly solution specifically designed for power modules, industrial power supplies, motor drives, renewable energy systems, automotive electronics, and high-current applications. Featuring thick copper circuitry, a black solder mask finish, and complete turnkey PCB manufacturing and assembly services, this PCB delivers exceptional current-carrying capacity, thermal management performance, and long-term operational reliability.

 

Key Specifications
Layer Count 16-Layer
Material PI
Board Thickness 1.0 mm (Customizable)
Copper Thickness 6/2/2/2/2/2/2/2/2/2/2/2/2/2/2/6 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Black
Surface Finish   Lead-free soldering

 

Product Description

Premium Polyimide Substrate Material

  • Excellent thermal resistance and dimensional stability.
  • Superior performance in high-temperature environments.
  • Ideal for aerospace, automotive, and industrial applications.

Thick Copper Technology

  • Enhanced current-carrying capability.
  • Reduced conductor resistance and voltage drop.
  • Suitable for high-power electronic systems.

Multilayer PCB Construction

  • Supports complex circuit architectures.
  • Improved signal routing and power distribution.
  • High-density design capability.

Outstanding Thermal Management

  • Efficient heat dissipation for power-intensive applications.
  • Improved reliability under continuous operation.
  • Reduced thermal stress on components.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm