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Double Layer Printed Circuit Board
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2 Layer Double Layer Flexible PCB Assembly 0.5mm Thickness UL Certified

2 Layer Double Layer Flexible PCB Assembly 0.5mm Thickness UL Certified

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
2-Layer
Material:
PI
Board Thickness:
0.6 Mm (Customizable)
Copper Thickness:
1/1 Oz
Surface Finish:
OSP
Supply Ability:
1 Million Square feet/per month
Highlight:

Double Layer Flexible PCB Assembly

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UL Flexible PCB Assembly

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2 Layer Flex PCB Assembly

Product Description

 

Double Layer Flexible PCB Assembly 0.5mm Thickness UL Certified

 

This double-layer flexible printed circuit board (FPC) features an overall thickness of 0.5mm and complies with UL safety certification standards. Manufactured with high-quality polyimide base material, the flexible PCB supports double-sided circuit routing with reliable plated through holes for electrical interconnection between top and bottom conductive layers. It can be bent, folded and shaped to fit compact, irregular device enclosures. Widely applied in consumer electronics, display modules, smart wearable devices, medical equipment and automotive internal wiring assemblies. Custom layouts, surface finishes and connector pads are available to meet individual project requirements.

 

Key Specifications
Layer Count 2-Layer
Material Polyimide (PI)
Board Thickness 0.6mm (Customizable)
Copper Thickness 0.5/0.5 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Yellow
Surface Finish   OSP

 

Product Description

1.Double-layer circuit design with plated through vias for interlayer connectivity
2. Ultra-slim 0.6mm total thickness, saving internal product space
3. UL certified material & manufacturing, meets international safety standards
4. Excellent flexibility, capable of dynamic bending and static folding installation
5. High tensile polyimide substrate, outstanding heat resistance and dimensional stability
6. Stable electrical performance, suitable for high-density signal transmission
7. Supports various surface treatments: ENIG, HASL, OSP, immersion silver
8. Customizable outline, pad layout, stiffener and gold finger design
9. Lightweight structure compared with rigid PCBs, effectively reducing product weight
10. RoHS compliant, eco-friendly lead-free production available

Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm