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Communication PCB
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4 Layer Lead Free HASL Communication PCB FR4 TG150 1.6mm Printed Circuit Board Assembly

4 Layer Lead Free HASL Communication PCB FR4 TG150 1.6mm Printed Circuit Board Assembly

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
4 L
Material:
FR4 TG150
Board Thickness:
1.6mm
Copper Thickness:
1/1/1/1 Oz
Minimum Hole Size:
0.2
Minimum Line Width:
0.15mm
Supply Ability:
1 Million Square feet/per month
Highlight:

4 Layer Communication PCB

,

Lead Free HASL Communication PCB

,

FR4 TG150 Printed Circuit Board Assembly

Product Description
4-Layer Lead-Free HASL Communication Equipment Module
4-layer lead-free HASL communication equipment module designed for high-performance communication applications.
Key Specifications
Parameter Specification
Layer Count 4 Layers
Material FR4 TG150
Board Thickness 1.6mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.15mm
Minimum Line Spacing 0.12mm
Solder Mask Color White
Surface Finish HASL (Lead-Free)
Application Field Communication Module
Technical Features
Material Selection & Characteristics
  • High-Frequency Performance: Low dielectric constant materials reduce signal transmission loss
  • High Reliability: Withstands complex outdoor environments including temperature/humidity changes and vibration
  • Signal Integrity: High-purity copper foil with low surface roughness
Manufacturing Process
  • High Precision: Laser Direct Imaging (LDI) technology for pattern transfer
  • Layer-to-Layer Registration: CNC and laser drilling for microvias (0.05mm-0.15mm)
  • Quality Control: Strict temperature and pressure profiles during lamination
Electrical Performance
  • Impedance Control: ±5% or ±10% tolerance using TDR verification
  • Signal Integrity: Guard routing and ground plane optimization
  • EMC Compliance: Metal shielding for RF sections
Reliability Assurance
  • Thermal Management: Thermal via arrays and copper heat-spreading channels
  • Environmental Protection: Conformal coating for moisture, salt fog, and fungus protection
  • Long-term Stability: IPC-6012 and IPC-6018 compliance
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm