|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
Tailored for integration into wireless communication modules and IoT connectivity solutions
| Layer Count | 4L |
| Material | FR4-TG140 |
| Board Thickness | 1.6 MM |
| Copper Thickness | 1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Blue |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Application Field | Communication Products |
We understand that the core of communication boards lies not in simple "layer count stacking," but in ensuring signal integrity under extreme precision scenarios. Xunsiwei focuses on BGA packaging and HDI technologies, providing deep solutions from design optimization to volume delivery for high-performance communications, IoT gateways, and intelligent electronic systems.
Our understanding of "customization" goes beyond simple dimensional modifications—it's about collaborative optimization starting from the design phase:
| Test Item | Industry Standard (Spot Check) | Xunsiwei Standard |
|---|---|---|
| Electrical Test | Flying probe spot check | 100% full inspection (flying probe + fixture), zero tolerance for open/short circuits |
| AOI Inspection | Outer layer only | Full-process AOI for inner and outer layers, no hiding place for fine line defects |
| Thermal Stress Test | 288℃/10S | 288℃/20S, 3 cycles, simulating extreme operating conditions |
| Impedance Consistency | First article confirmation | Batch sampling + SPC process control, CpK ≥ 1.33 |
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
polski
فارسی
বাংলা
ไทย
tiếng Việt
العربية
हिन्दी
Türkçe
indonesia
