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4 Layer Immersion Gold Multi PCB Circuit Boards For Communication Handsets

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

Material:

FR4 TG170

Board Thickness:

1.2 Mm

Copper Thickness:

1/1/1/1 Oz

Minimum Hole Size:

0.2 Mm

Minimum Line Width:

0.1 Mm

Minimum Line Spacing:

0.1 Mm

Supply Ability:

1 Million Square feet/per month

Highlight:

4 Layer Multi PCB

Immersion Gold Multi PCB

4 Layer Multi Circuit Boards

Product Description

4-Layer PCB Motherboard for Mobile Communication Devices

This product is specifically designed for communication mobile phones, aiming to provide a stable and reliable user experience as well as efficient application solutions.

Key Specifications

Layer Count	4
Material	FR4 TG170
Board Thickness	1.2 mm
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Application Field	Mobile phone communication

Product Features

4-Layer Precision Impedance Design ensures optimized and stable signal transmission
All buttons adopt ENIG (Immersion Gold) process for improved sensitivity and durability
Comprehensive Quality Control System covering various rigorous inspections and electrical functional testing
Communication-Grade Design guarantees smooth and stable daily use
PCB Solutions tailored specifically for the communication handset sector

We provide one-stop PCB solutions for the communication field, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptability to meet long-term stable operation requirements.

Advantages of Custom PCB Solutions

Highly Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and excellent anti-interference performance, ensuring stable operation even in harsh environments
Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm