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8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

8 L

Material:

FR4 TG150

Board Thickness:

1.6mm

Copper Thickness:

1/1/1/1 Oz

Minimum Hole Size:

0.2mm

Minimum Line Width:

0.1mm

Supply Ability:

1 Million Square feet/per month

Highlight:

8 Layer Communication PCB

Communication PCB FR4 TG150

8 Layer OSP Coating PCB

Product Description

8-layer OSP Black Communication Module

High-performance 8-layer communication module featuring OSP surface finish and black solder mask, designed for reliable operation in communication applications.

Key Specifications

Parameter	Specification
Layer Count	8 Layers
Material	FR4 TG150
Board Thickness	1.2mm
Copper Thickness	1/0.5/0.5/1 oz
Minimum Hole Size	0.2mm
Minimum Line Width	0.12mm
Minimum Line Spacing	0.12mm
Solder Mask Color	Black
Surface Finish	OSP
Application Field	Communication Module

Critical Production Processes

Vacuum lamination technology for inner layer pattern transfer to ensure tight adhesion and prevent bubble generation
Automated Optical Inspection (AOI) after inner layer etching to detect defects including undercuts, pinholes, and shorts
Strict control of temperature ramp rate (1.5-2.5°C/min) and pressure profile during lamination to prevent delamination
Coated drill bits for drilling process to reduce hole wall burrs, followed by desmearing and potassium permanganate cleaning
Plasma treatment before electroless copper deposition to improve hole wall roughness and adhesion
Backlight testing after copper deposition to ensure quality
Board brushing and sandblasting before solder mask spraying to improve ink adhesion
Parallel light exposure machine for solder mask exposure with energy uniformity ≥85%
Micro-etch roughening treatment before lead-free HASL with micro-etch depth of 1.5-2.5μm
Board baking (120°C/1h) to remove moisture and prevent solder splash
Controlled vertical board withdrawal speed during HASL for uniform tin layer thickness (±5μm)
Cooling and flattening after HASL with warpage inspection (≤0.75%)
100% electrical testing using flying probe or universal fixture testing

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm