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High Precision 8 Layer ENIG PCB Circuit Board Assembly Services For Industrial Control

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

8 L

Material:

FR4 TG150

Board Thickness:

1.6mm

Copper Thickness:

1/1/1/1 Oz

Minimum Hole Size:

0.2

Minimum Line Width:

0.1mm

Supply Ability:

1 Million Square feet/per month

Highlight:

High Precision PCB Circuit Board

ENIG PCB Circuit Board

8 Layer Circuit Board Assembly Services

Product Description

8-layer ENIG Black Base Station Equipment Board

This high-performance 8-layer PCB features a 1.6mm board thickness using TG150 material with blue solder mask. The surface finish is ENIG (Electroless Nickel Immersion Gold), with precise trace width/spacing of 0.1mm, inner layer copper thickness of 0.5oz, and outer layer copper thickness of 1.0oz.

Key Specifications

Layer Count	8 Layers
Material	FR4 TG150
Board Thickness	1.6mm
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.2mm
Minimum Line Width	0.1mm
Minimum Line Spacing	0.1mm
Solder Mask Color	Blue
Surface Finish	ENIG
Application Field	Industrial Control

Critical Production Processes

Inner layer core board target punching accuracy: ±25μm
Hot melt riveting fixation to prevent board sliding during lamination
LDI exposure equipment for inner layer pattern transfer with increased exposure energy compensation for fine line areas
100% AOI inspection and line width measurement after inner layer etching
Low-flow prepreg lamination process with temperature ramp rate maintained between 1.5-2.0°C/min
Scanning acoustic microscopy for delamination and void defect detection
Coated drill bits with optimized retract speed to reduce burrs
Plasma treatment before electroless copper deposition for improved hole wall adhesion
V-cut or routing processes for final shaping to prevent fiberglass burrs

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm