|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Layer Count | 8 Layers |
| Material | FR4 |
| Board Thickness | 1.0 mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Black |
| Surface Finish | OSP |
| Application Field |
Industrial Control and Automation Systems |
Our multilayer high-density PCBA printed circuit board assemblies are specially engineered for tablet devices. Adopting advanced HDI high-density wiring technology, these multilayer circuit boards achieve compact line width/spacing and dense component layout, which perfectly satisfy the thin, lightweight and miniaturization design demands of tablets.
We provide turnkey PCBA services including multilayer PCB fabrication, component sourcing, SMT mounting, BGA soldering, functional testing and final assembly. The boards support stable transmission of display signals, power management, touch control and wireless communication circuits inside tablets. Manufactured in accordance with IPC, UL and RoHS standards, they deliver reliable performance for consumer tablet PCs, educational tablets and industrial rugged tablets. Custom Gerber-based development, prototype sampling and mass production are all supported.
1.Multilayer HDI high-density wiring design, realize miniaturization layout for slim tablet structure
2.Support fine line width & spacing, micro vias, suitable for dense chip placement such as CPU, PMIC
3.Turnkey one-stop service: PCB manufacturing + components procurement + SMT & BGA assembly + testing
4.Optimized impedance control for LCD display, touch screen, Wi-Fi/Bluetooth signal transmission
5.Multiple surface finishes optional: ENIG, immersion gold, OSP to meet tablet long-term stability requirements
6.Strict quality control: AOI, X-Ray inspection, ICT and functional testing before delivery
7.High TG substrate options, excellent thermal stability to adapt tablet continuous operation
8.Meet RoHS lead-free requirements, UL certification available upon customer request
9.Thin board thickness options, matching ultra-thin tablet shell assembly space limitation
10.Widely applicable for consumer tablets, kids learning tablets, industrial rugged tablet motherboards
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
polski
فارسی
বাংলা
ไทย
tiếng Việt
العربية
हिन्दी
Türkçe
indonesia
