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| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Layer Count | 6 Layers |
| Material | FR408HR Laminate |
| Board Thickness | 1.60 mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Blue |
| Surface Finish | Lead-Free HASL (Tin Spray) |
| Application Field |
Industrial Control and Automation Systems |
This 6-layer printed circuit board adopts FR408HR high-performance FR-4 substrate, finished at standard 1.6mm board thickness, equipped with blue solder mask and electroless immersion gold surface treatment.
FR408HR material features high glass transition temperature (High TG), low thermal expansion and outstanding thermal reliability, capable of resisting repeated thermal cycles during SMT reflow soldering, effectively reducing PCB delamination and warpage. The bright blue solder mask provides excellent insulation, anti-oxidation and circuit protection, while immersion gold delivers flat, uniform pad surface, superior solderability and stable contact performance for fine-pitch ICs, connectors and BGA components.
We support customized impedance control, blind/buried vias, HDI design and customer circuit layout. Manufactured strictly in accordance with IPC standards and compliant with RoHS & UL requirements. Widely applied in industrial controllers, communication modules, automotive electronics, test equipment and consumer electronic mainboards. Prototype samples and mass production orders are welcomed.
1.Core raw material: FR408HR high-Tg high-reliability FR4 laminate
2.6-layer multilayer stack-up, finished board thickness: 1.6mm standard thickness
3.Blue liquid photoimageable solder mask for circuit insulation and protection
4.Immersion Gold (ENIG) surface finish with uniform flat pads, long shelf life
5.Excellent thermal resistance, withstand multiple lead-free reflow processes
6.Low Z-axis thermal expansion, minimize risk of hole cracking & board delamination
7.High mechanical stability, less warpage suitable for automated high-speed SMT
8.Blue solder mask improves visual inspection efficiency during assembly & testing
9.Support customized line width, hole size, impedance and special routing requirements
10.Meet RoHS lead-free specification, UL certification available upon request
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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