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4 Layer ENIG Surface Finish Multilayer Printed Circuit Board For Smart Building Applications

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

Material:

FR4

Board Thickness:

1.6 Mm

Copper Thickness:

1/1/1/1 Oz

Minimum Hole Size:

0.2 Mm

Minimum Line Width:

0.15 Mm

Minimum Line Spacing:

0.2 Mm

Supply Ability:

1 Million Square feet/per month

Highlight:

ENIG Multilayer Printed Circuit Board

4 Layer Multilayer Printed Circuit Board

Product Description

4-Layer Blue ENIG PCB for Smart Building

This 4-layer printed circuit board is specifically designed for smart building equipment, featuring ENIG surface finish to provide high-reliability control application solutions for smart access control systems.

Key Specifications

Specification	Value
Layer Count	4L
Material	FR4
Board Thickness	1.6 mm
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.15 mm
Minimum Line Spacing	0.2 mm
Solder Mask Color	Black
Surface Finish	ENIG (Electroless Nickel Immersion Gold)
Application Field	Power Supply Level

Product Features

4-Layer Precision Design for optimal performance
Heavy copper construction for enhanced current carrying capacity
Comprehensive Quality Control with rigorous AOI inspection and electrical testing
Industrial Reliability engineered for harsh industrial environments

PCB Solutions for Security Applications

We provide one-stop PCB solutions tailored for security and surveillance scenarios, integrating material grading, precision manufacturing, full-process inspection, and environmental adaptation to meet 24/7 stable operation requirements.

Advantages of Custom PCB Solutions

Fully Customizable: Supports customization of dimensions, thickness, layer count, and various functional requirements to flexibly meet diverse application needs
High-Performance Materials: Utilizes FR-4 and medium-to-high TG materials, offering excellent heat resistance, moisture resistance, and long-term stability
Superior Reliability: Features high dielectric strength, robust voltage withstand capability, and strong anti-interference performance, ensuring stable operation even in harsh environments
Professional Surface Finishes: Provides options such as ENIG, lead-free HASL, and OSP to ensure excellent solderability and long-term reliability

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm