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Automotive Printed Circuit Board
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ODM Automotive PCB Assembly 6 Layer PCB Board Fabrication

ODM Automotive PCB Assembly 6 Layer PCB Board Fabrication

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
6-Layer
Material:
FR-4 TG150
Board Thickness:
1.0 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

ODM Automotive PCB Assembly

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UL Automotive PCB Assembly

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6 Layer PCB Board Fabrication

Product Description

ODM Automotive PCBA Assembly 6 Layer Board Fabrication

 

Automotive 6-layer through-hole immersion gold green solder mask, with strict control over interlayer misalignment and immersion gold layer stress. Interlayer misalignment ≤70μm, X-ray sampling inspection, warpage ≤0.5%. Drill burrs ≤10μm, hole wall roughness ≤20μm, backlight level ≥9. Plasma cleaning before immersion gold, gold thickness 0.05-0.10μm, nickel layer phosphorus content 8-11%, internal stress controlled at 80-120MPa. After green solder mask development, side etching ≤5μm, post-curing at 150℃×65min, insulation resistance ≥100MΩ. After thermal stress at 288℃×10s×3 times, through-hole copper elongation ≥12%, green solder mask blister-free. Ion contamination ≤0.6μg/cm², CAF testing for 500h per batch. Automotive-specific UL code engraved on board edges.

 

Key Specifications
Layer Count 6-Layer
Material FR-4 TG150
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

Automotive-Grade 6-Layer PCB Structure

  • Optimized 6-layer stack-up for automotive electronic systems.
  • Dedicated signal, power, and ground layers improve circuit stability.
  • Suitable for complex vehicle control and communication applications.

Automotive Electronics Reliability

  • Designed to withstand demanding automotive operating environments.
  • Excellent performance under temperature fluctuations, vibration, and humidity.
  • Supports long-term operation in critical vehicle systems.

High-Density Circuit Integration

  • Enables compact and complex automotive electronic designs.
  • Supports advanced ECUs, sensors, and communication modules.
  • Improves system functionality while reducing board size.

Advanced SMT & THT Assembly

  • Supports Surface Mount Technology (SMT) and Through-Hole Technology (THT).
  • Compatible with BGA, QFN, LGA, CSP, and fine-pitch components.
  • Ensures accurate component placement and assembly quality.

Excellent Signal Integrity

  • Optimized multilayer routing reduces signal interference.
  • Minimizes EMI and crosstalk between circuits.
  • Suitable for high-speed automotive communication networks.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm