6 Layer Vehicle Communication Circuit Board With Immersion Gold

Product Description:

1. Material Selection

Substrate: High Tg material (glass transition temperature ≥150°C) is selected to meet heat resistance and CAF (Conductive Anodic Filament) resistance requirements.

Copper Foil: Low-roughness copper foil is used in high-frequency signal areas to reduce signal transmission loss.

Surface Finish: Immersion gold (ENIG) process is preferred, with precise control of gold layer thickness (0.15-0.2μm for RF areas) to ensure solderability, oxidation resistance, and low contact resistance.

2. Precision Circuit Fabrication

Due to the high integration level of vehicle-mounted terminals, LDI (Laser Direct Imaging) technology is adopted to achieve high-precision circuit pattern transfer, with line width/line spacing controlled below 50μm. Line width tolerance is strictly controlled (±5μm or ±0.02mm) to avoid signal integrity issues caused by over-etching or incomplete etching.

3. Multilayer Board Lamination

Supports 4-16 layers (including HDI/any-layer) high-density interconnect design. High-precision alignment systems and vacuum lamination processes are employed to strictly control layer-to-layer registration (layer misalignment ≤10% of hole diameter), ensuring multilayer board bonding strength and reliability.

4. Impedance Control

RF communication (4G/5G, V2X) and high-speed digital signals (Ethernet) in vehicle-mounted terminals have strict impedance control requirements. Precise control of line width, dielectric thickness, and dielectric constant is required to ensure characteristic impedance tolerances (e.g., 50Ω single-ended, 100Ω differential) within ±5% to ±10%.