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Automotive Printed Circuit Board
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Multilayer Automotive Printed Circuit Board High Frequency Hybrid PCB Board

Multilayer Automotive Printed Circuit Board High Frequency Hybrid PCB Board

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
8-Layer
Material:
Rogers, Teflon, PTFE
Board Thickness:
1.0 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1 Oz
Surface Finish:
Green
Supply Ability:
1 Million Square feet/per month
Highlight:

Multilayer Automotive Printed Circuit Board

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Hybrid Automotive Printed Circuit Board

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High Frequency Hybrid PCB

Product Description

Multilayer High Frequency Hybrid PCB Board For Aviation Automotive Machinery Industry

 

The Multilayer High Frequency Hybrid PCB Board is designed for demanding applications in the aviation, automotive, industrial machinery, and advanced communication industries. Combining high-frequency materials with conventional FR4 substrates, this hybrid PCB structure delivers an optimal balance of signal performance, mechanical strength, thermal stability, and cost efficiency.

Manufactured using advanced multilayer PCB technology, the board supports high-speed signal transmission, RF circuits, power management systems, and complex electronic assemblies. The hybrid material construction minimizes signal loss while maintaining excellent structural reliability, making it ideal for mission-critical systems operating in harsh environments.

 

Key Specifications
Layer Count 8-Layer
Material Rogers, Teflon, PTFE
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.12 mm
Minimum Line Spacing 0.076 mm
Solder Mask Color Green
Surface Finish   ENIG, HASL, OSP, Immersion Silve

 

Product Description

  • Hybrid Material Construction
    • Combines high-frequency laminates with FR4 materials for optimized performance and cost control.
    • Suitable for mixed-signal, RF, and high-speed digital applications.
  • Excellent High-Frequency Performance
    • Low dielectric loss supports stable RF and microwave signal transmission.
    • Reduces insertion loss and signal attenuation.
  • Multilayer PCB Design
    • Supports complex circuit routing and high-density component placement.
    • Improves power distribution and signal integrity.
  • Superior Signal Integrity
    • Controlled impedance routing minimizes crosstalk and electromagnetic interference.
    • Ensures reliable operation in high-speed electronic systems.
  • High Thermal Stability
    • Maintains electrical performance under elevated temperatures and continuous operation.
    • Suitable for harsh industrial and automotive environments.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm