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3mm Thickness FR4 4 Layer Server PCB Circuit Board For 5G Base Station

3mm Thickness FR4 4 Layer Server PCB Circuit Board For 5G Base Station

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
4-Layer
Material:
FR4
Board Thickness:
3.0 Mm (Customizable)
Copper Thickness:
2/2/2/2 Oz
Surface Finish:
Black
Supply Ability:
1 Million Square feet/per month
Highlight:

4 Layer Server PCB

,

3mm Server PCB

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4 Layer FR4 Circuit Board

Product Description

FR4 3mm Thickness 4-Layer Server PCB Board for 5G Base Station with 2OZ Copper and 0.3mm Min Hole Size

 

The FR4 3mm Thickness 4-Layer Server PCB Board is designed for high-performance server systems, 5G base station equipment, data communication infrastructure, and industrial networking applications. Manufactured using premium FR4 laminate material, this multilayer PCB features a robust 3.0mm board thickness, 2OZ heavy copper, and a minimum hole size of 0.3mm, providing excellent electrical performance, mechanical strength, and thermal stability.

Engineered to support high-speed signal transmission and high-current power delivery, this 4-layer PCB board ensures reliable operation in demanding telecommunications and data center environments. Advanced PCB fabrication processes enable precise impedance control, superior signal integrity, and stable performance for mission-critical networking and server hardware.

 

Key Specifications
Layer Count 4-Layer
Material FR4
Board Thickness 3.0 mm (Customizable)
Copper Thickness 2/2/2/2 oz
Minimum Hole Size 0.3 mm
Minimum Line Width 0.25 mm
Minimum Line Spacing 0.25 mm
Solder Mask Color Black
Surface Finish   ENIG

 

Product Description

  • 4-Layer Multilayer PCB Structure
    • Optimized layer stack-up for high-speed digital signals and power distribution.
    • Improves EMI suppression and signal integrity.
  • 3.0mm Heavy-Duty Board Thickness
    • Enhanced mechanical strength and rigidity.
    • Suitable for large-format server and telecom equipment.
  • 2OZ Heavy Copper Circuitry
    • Supports higher current loads and improved thermal performance.
    • Reduces voltage drop and power loss in high-power applications.
  • 0.3mm Minimum Hole Size
    • High-precision drilling technology enables dense component placement.
    • Supports complex server and communication board designs.
  • Premium FR4 Material
    • Excellent electrical insulation and dimensional stability.
    • Reliable performance under continuous operation.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm