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5G High Speed PCB Design Server Communication Electronic Equipment PCB

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

6-Layer

Material:

FR4

Board Thickness:

1.6 Mm (Customizable)

Copper Thickness:

1/1/1/1/1/1 Oz

Surface Finish:

Green

Supply Ability:

1 Million Square feet/per month

Highlight:

5G High Speed PCB Design

Communication Electronic Equipment PCB

Product Description

5G Printed Circuit Board Server Communication Electronic Equipment PCB High Speed

The 5G Printed Circuit Board (PCB) for Server Communication Electronic Equipment is specifically designed to meet the demanding requirements of high-speed data transmission, cloud computing, telecommunications infrastructure, and next-generation 5G networks. Built with advanced multilayer PCB technology and high-performance low-loss materials, this PCB delivers exceptional signal integrity, stable power distribution, and superior electromagnetic compatibility.

Key Specifications

Layer Count	6-Layer
Material	FR4
Board Thickness	1.6 mm (Customizable)
Copper Thickness	1/1/1/1/1/1 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

High-Speed Data Processing
- Designed to handle large volumes of data with minimal latency.
- Supports advanced server and networking architectures.
Excellent Signal Integrity
- Controlled impedance design minimizes signal loss and crosstalk.
- Ensures reliable performance for high-speed communication protocols.
Multilayer PCB Construction
- Provides dedicated power and ground planes for stable signal routing.
- Supports complex circuit designs and dense component placement.
Low-Loss Material Compatibility
- Available with high-frequency materials for superior transmission performance.
- Ideal for RF and microwave communication applications.
Superior EMI/EMC Performance
- Advanced layer stack-up reduces electromagnetic interference.
- Enhances communication stability in high-density electronic systems.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm