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12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

12-Layer

Material:

FR4

Board Thickness:

1.6 Mm (Customizable)

Copper Thickness:

1/1/1/1/1/1/1/1/1/1/1/1 Oz

Surface Finish:

Green

Supply Ability:

1 Million Square feet/per month

Highlight:

Server Communication PCB

12 Layer Communication PCB

Data Processing 12 Layer PCB

Product Description

12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

The 12 Layers Server Communication PCB is engineered for high-speed data processing, secure communication, and large-scale data storage applications. Designed with a complex multilayer stack-up, this PCB provides exceptional signal integrity, power distribution efficiency, and electromagnetic interference (EMI) suppression required by modern servers, data centers, cloud computing platforms, and communication equipment.

Manufactured using high-quality low-loss materials and advanced PCB fabrication technology, the board supports high-frequency signal transmission, high-density component integration, and reliable long-term operation. Its 12-layer architecture enables optimized routing for high-speed interfaces, ensuring stable performance in mission-critical networking, storage, and enterprise computing environments.

Key Specifications

Layer Count	12-Layer
Material	FR4
Board Thickness	1.6 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.25 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

12-Layer High-Density Design
- Provides ample routing space for complex server and communication circuits.
- Supports high-density component placement and advanced processor architectures.
High-Speed Signal Integrity
- Optimized stack-up structure minimizes signal loss, crosstalk, and transmission delays.
- Suitable for high-speed networking and data communication protocols.
Fast Data Processing Capability
- Designed to support multi-core processors, memory modules, and high-bandwidth interfaces.
- Enables efficient data transfer within server and storage systems.
Enhanced Data Security and Reliability
- Stable power distribution and signal routing help ensure secure and uninterrupted system operation.
- Reduces communication errors in critical applications.
Excellent EMI and EMC Performance
- Multiple ground and power planes improve electromagnetic compatibility.
- Minimizes interference in high-frequency environments.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

Tags:

Single Layer Printed Circuit Board

Double Layer Printed Circuit Board

Multilayer Printed Circuit Board

HDI Printed Circuit Board

High Frequency Printed Circuit Board

Server PCB

Communication PCB

Industrial Control PCB

Copper Substrate PCB

Medical Circuit Board

Automotive Printed Circuit Board

Drone PCB Board

5G Optical Module PCB

Radio Frequency PCB