products details

Created with Pixso. Home Created with Pixso. Products Created with Pixso.
Server PCB
Created with Pixso.

Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
6-Layer
Material:
FR4
Board Thickness:
1.6 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1 Oz
Surface Finish:
Green
Supply Ability:
1 Million Square feet/per month
Highlight:

Network Server PCB

,

Server PCB 6 Layer

,

1.6mm Multilayer PCB Board

Product Description

1.6 mm Board Thickness 6 Layer Multilayer Pcb Network Server PCB

The 1.6 mm Board Thickness 6 Layer Multilayer PCB is designed for network servers, data communication equipment, storage systems, and high-speed computing applications. Built with a six-layer stack-up structure, this PCB provides excellent signal integrity, stable power distribution, and enhanced EMI suppression for demanding networking environments. Manufactured using high-quality FR-4 materials and advanced PCB fabrication processes, it supports high-density component layouts and reliable long-term operation in enterprise-grade server systems.

Key Specifications
Layer Count 6-Layer
Material FR4
Board Thickness 1.6 mm (Customizable)
Copper Thickness 1/1/1/1/1/1 oz
Minimum Hole Size 0.25 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

  • 6-Layer Multilayer Design
    • Optimized routing for high-speed signals and complex network architectures.
    • Supports dense component placement and advanced server motherboard layouts.
  • Standard 1.6 mm Board Thickness
    • Provides excellent mechanical strength and dimensional stability.
    • Compatible with industry-standard server and networking equipment.
  • Superior Signal Integrity
    • Controlled impedance design for high-frequency data transmission.
    • Reduces signal loss, crosstalk, and transmission errors.
  • Reliable Power Distribution
    • Dedicated power and ground planes improve voltage stability.
    • Supports high-performance processors, memory modules, and communication chips.
  • Enhanced EMI/EMC Performance
    • Multilayer stack-up structure minimizes electromagnetic interference.
    • Suitable for high-speed Ethernet, cloud computing, and data center applications.
  • High Manufacturing Precision
    • Supports fine line widths, small vias, and high-density interconnect layouts.
    • Ideal for advanced networking and server hardware designs.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm