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| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
This 4-layer FR4 printed circuit board is specially engineered for 5G base station and communication server equipment. Constructed with 3mm thick high TG FR4 substrate, 2OZ heavy copper foil and minimum 0.3mm finished hole size, the PCB delivers excellent current carrying capacity, mechanical rigidity and stable electrical performance for long-term continuous operation of outdoor and indoor 5G communication hardware.
Thick 2OZ copper design satisfies high-power circuit transmission demand; the 0.3mm minimum drill hole meets dense component layout requirements. We support customized impedance control, anti-tarnish surface treatments including ENIG, OSP and immersion silver. All production follows strict IPC-A-600 & IPC-2221 standards, compliant with RoHS and UL certification requirements. Widely adopted in 5G remote radio units (RRU), baseband processing boards, power amplifier modules and communication server control boards. Prototype sampling and mass volume orders are both acceptable.
| Layer Count | 4-Layer |
| Material | FR4 |
| Board Thickness | 3.0mm (Customizable) |
| Copper Thickness | 2/1/1/2 oz |
| Minimum Hole Size | 0.3 mm |
| Minimum Line Width | 0.25 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Black |
| Surface Finish | ENIG |
Product Description
1.4-layer rigid PCB built with 3mm thick FR4 substrate, great mechanical strength and low warpage
2.2OZ heavy copper thickness, outstanding load capacity for high-current power circuits
3.0.3mm minimum finished hole size, supports dense component arrangement
4.Optional high TG FR4 material, excellent heat resistance adapting continuous 5G station operation
5.Custom impedance control available for stable high-frequency signal transmission
6.Multiple surface finish options: ENIG, Immersion Silver, OSP, HASL lead-free
7.Thick board structure improves vibration resistance, suitable for outdoor 5G base station environment
8.Strict inspection: Flying probe electrical test, AOI optical inspection, hole size dimensional verification
9.Meet RoHS lead-free environmental standards, UL certification can be provided upon request
10.Customizable outline, circuit layout and stack-up based on customer Gerber data
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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