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| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Layer Count | 6 Layers |
| Material | FR-4 |
| Board Thickness | 0.6 Mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-Free HASL (Tin Spray) |
| Application Field |
Industrial Control and Automation Systems |
This 6-layer multilayer PCB adopts advanced via filled and via-in-pad technology together with blind via structure, with finished board thickness of 0.6mm, specially designed for GPS tracking devices.
Via filling and via-in-pad design eliminates solder wicking during SMT assembly, improves soldering integrity for BGA and compact chips, saves valuable PCB surface space for high-density component layout. Blind vias realize interconnection between adjacent layers without penetrating the whole board, effectively shortening signal paths, reducing signal interference and enhancing positioning signal stability for GPS modules.
The slim 0.6mm overall thickness meets the lightweight and miniaturization requirements of portable GPS trackers. We support customized impedance tuning for GPS RF circuits and offer multiple surface finishes including ENIG, OSP and Immersion Silver. All products are produced in accordance with IPC standards and comply with RoHS regulations. Widely used in vehicle GPS trackers, asset location trackers, personal GPS positioning devices and wearable tracking modules. Prototype samples and mass production orders are available.
1.6-layer multilayer PCB integrated with via filled & via in pad construction
2.Adopt blind via technology, shorten signal channels and optimize high-frequency GPS signal performance
3.Slim 0.6mm finished board thickness, match thin compact GPS tracker housing design
4.Via-in-pad & filled vias prevent solder leakage, ensure reliable BGA soldering quality
5.Optimized circuit layout for GPS RF positioning signal, customizable impedance control
6.High-density wiring capability, help realize miniaturization of portable tracking equipment
7.Reduce electromagnetic interference, improve receiving sensitivity of GPS antenna circuits
8.Multiple surface finish options: ENIG, OSP, immersion gold suitable for RF modules
9.Precise dimensional control, low warpage for automated SMT mass assembly
10.RoHS compliant, manufactured following IPC 6012 printed circuit board specifications
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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