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FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

6 Layers

Material:

FR4 TG150

Board Thickness:

1.6mm

Copper Thickness:

1/1/1/1 Oz

Minimum Hole Size:

0.2mm

Minimum Line Width:

0.1mm

Supply Ability:

1 Million Square feet/per month

Highlight:

6 Layer ENIG PCB

FR4 TG150 ENIG PCB

6 Layer Mobile Phone PCB Board

Product Description

6-layer ENIG Blue Mobile Phone Module

This advanced 6-layer mobile phone module features ENIG surface finish and blue solder mask, specifically designed for mobile communication applications with high-frequency performance requirements.

Key Specifications

Specification	Value
Layer Count	6 Layers
Material	FR4
Board Thickness	1.2mm
Copper Thickness	1/1/1/1 oz
Minimum Hole Size	0.2mm
Minimum Line Width	0.1mm
Minimum Line Spacing	0.1mm
Solder Mask Color	Blue
Surface Finish	ENIG
Application Field	Mobile Communication

Critical Production Processes

Inner layer core board undergoes browning treatment for uniform film density
CCD automatic alignment exposure with ±25μm interlayer accuracy
100% AOI inspection and line width measurement after inner layer etching
Hot oil press lamination with ±2°C temperature uniformity and vacuum assist
X-Ray measurement with ≤75μm interlayer misalignment control
Scanning acoustic microscopy for delamination and void detection
High-precision CNC drilling with backup board structures
Desmearing and potassium permanganate treatment before electroless copper
Vacuum screen printer for solder mask application
Plasma roughening before ENIG for enhanced adhesion
Comprehensive testing including tape pull, bend testing, and TDR impedance

Technical Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm