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2.0mm Multilayer HDI PCB Board Assembly With Green Solder Mask

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

10-Layer

Material:

FR4

Board Thickness:

2mm (Customizable)

Copper Thickness:

1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 Oz

Supply Ability:

1 Million Square feet/per month

Highlight:

Multilayer HDI PCB Board

2.0mm HDI PCB Board

Multilayer PCB Board Assembly

Product Description

2.0mm Multilayer HDI PCB Board Assembly With Green Solder Mask

10-layer, three-stage OSP (Optical Sealant Propagation) green solder mask board, featuring a combination of laser-drilled vias and mechanically drilled through-holes, with strict control over drill residue removal and OSP uniformity. Mechanically drilled through-hole burrs are ≤8μm, and overlapping areas with blind vias undergo two rounds of adhesive removal. UV strengthening is applied after green solder mask development to enhance surface hardness. Micro-etching of the copper surface before OSP film application achieves a uniform pink appearance, with a film thickness of 0.25-0.4μm. Four simulated reflow soldering cycles are performed, with a wetting angle ≤25° and no film cracking. Ion contamination testing is conducted on each batch.

Key Specifications

Layer Count	10-Layer
Material	FR4
Board Thickness	2mm (Customizable)
Copper Thickness	1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Green
Surface Finish	Immersion Gold (ENIG)

Product Description

10-Layer High-Density Interconnect (HDI) Design
Advanced 10-layer HDI PCB structure provides higher routing density, improved signal integrity, and enhanced electrical performance for complex electronic applications.
2.0mm Board Thickness for Enhanced Stability
The 2.0mm thick PCB offers superior mechanical strength, durability, and resistance to warping, making it suitable for industrial and high-reliability devices.
Green Solder Mask Protection
High-quality green solder mask improves insulation performance, protects copper traces from oxidation, and enhances PCB durability during assembly and operation.
Fine Line and Microvia Technology
Supports laser-drilled microvias, blind vias, and buried vias, enabling compact circuit layouts and high-density component placement.
Excellent Signal Integrity
Optimized multilayer stack-up minimizes electromagnetic interference (EMI) and crosstalk, ensuring stable high-speed signal transmission.
High Precision PCB Assembly Service
Compatible with advanced SMT and THT assembly processes, supporting fine-pitch ICs, BGA packages, and complex electronic components.
Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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