|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
Custom 4 Layer 1+N+1 HDI PCB Board Assembly with Laser Microvias and ENIG Finish is designed for high-density electronic applications that require enhanced signal integrity, compact layouts, and reliable performance. Utilizing advanced laser-drilled microvia technology, this HDI PCB enables higher routing density, reduced signal loss, and improved electrical performance compared to conventional multilayer boards. The 1+N+1 stack-up structure provides an ideal balance between complexity, cost efficiency, and manufacturing reliability.
| Layer Count | 4-Layer |
| Material | FR-4 TG150 |
| Board Thickness | 0.33mm (Customizable) |
| Copper Thickness | 1/0.5/0.5/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Black |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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