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10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics

10 Layer High Density Interconnect PCB With Blue Solder Resist For Precision Electronics

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
10-Layer
Material:
FR-4
Board Thickness:
1.0mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1/1/1oz
Surface Finish:
Immersion Gold (ENIG)
Supply Ability:
1 Million Square feet/per month
Highlight:

10 Layer High Density Interconnect PCB

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Electronics High Density Interconnect PCB

Product Description
10 Layer High-Density Interconnect PCB with Blue Solder Resist for Precision Electronics

Custom 10 Layer 1+N+1 HDI PCB with Blue Solder Mask and ENIG Finish is engineered for high-density electronic applications requiring reliable blind-via interconnections, excellent solderability, and superior manufacturing consistency. Featuring a 10-layer stack-up combined with first-order HDI technology, the PCB provides enhanced routing capability and optimized signal integrity for advanced electronic devices.

Key Specifications
Layer Count 10-Layer
Material FR-4
Board Thickness 1.0 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Blue
Surface Finish   Immersion Gold (ENIG)

 

Product Description

10-Layer 1+N+1 HDI Structure

  • Advanced multilayer PCB design with first-order HDI technology.
  • Optimized routing density and signal transmission performance.
  • Suitable for compact, high-performance electronic products.

High Blind-Via Yield Control

  • Laser-drilled blind vias with strict process management.
  • No stub residue permitted at blind-via bottoms.
  • Ensures stable electrical connectivity and long-term reliability.

Advanced Desmear Process

  • Complete resin removal after laser drilling.
  • Backlight inspection grade ≥ Level 9.
  • Improves metallization quality and via reliability.

Premium Blue Solder Mask Technology

  • Industry-standard blue solder resist with excellent appearance.
  • Optimized for fine-line circuit manufacturing.
  • Provides strong environmental and chemical resistance.

Low-Viscosity Ink Process

  • Special low-viscosity solder mask formulation.
  • Enhanced coating uniformity across high-density structures.
  • Reduces risk of incomplete development.

Precision Screen Printing Control

  • Printing pressure maintained between 4–6 kg/cm².
  • Prevents ink penetration into microvias and drilled holes.
  • Ensures accurate solder mask definition.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm