|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
This 6-layer 1st-order HDI (High-Density Interconnect) PCB features immersion gold (ENIG) surface finish with green oil solder mask, specifically engineered for applications requiring high-density routing and reliable blind via interconnects. The 1+N+1 stack-up structure with laser-drilled blind vias ensures superior signal integrity and space optimization for compact electronic devices. Rigorous process control is applied to laser blind via formation, solder mask development matching, and ENIG plating quality to deliver consistent PCB performance for demanding electronics applications.
| Layer Count | 6-Layer |
| Material | FR4 |
| Board Thickness | 1.6mm (Customizable) |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.075 mm |
| Minimum Line Spacing | 0.075 mm |
| Solder Mask Color | Green |
| Surface Finish | Immersion Gold (ENIG) |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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