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HDI Printed Circuit Board
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14 Layer One Stop HDI PCB Board With ENIG Surface Finish Black Solder Mask

14 Layer One Stop HDI PCB Board With ENIG Surface Finish Black Solder Mask

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
14-Layer
Material:
FR-4 TG170
Board Thickness:
1.2mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1/1/1/1/1/1/1 Oz
Surface Finish:
Immersion Gold (ENIG)
Supply Ability:
1 Million Square feet/per month
Highlight:

14 Layer HDI PCB Board

,

One Stop HDI PCB Board

Product Description
14 Layer 1-Step HDI PCB Board with ENIG Surface Finish and Black Solder Mask

Custom 14 Layer 1+N+1 HDI PCB with Black Solder Mask and ENIG Finish is designed for high-speed, high-density, and mission-critical electronic applications requiring exceptional layer registration accuracy, electrical performance, and long-term reliability. Combining a complex 14-layer stack-up with first-order HDI technology, this PCB provides an optimal balance between routing capability and manufacturing stability.

Key Specifications
Layer Count 14-Layer
Material FR-4 TG170
Board Thickness 1.2 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Black
Surface Finish   Immersion Gold (ENIG)

 

Product Description

14-Layer High-Density PCB Structure

  • Advanced 14-layer stack-up design for complex routing requirements.
  • Supports high-speed signal transmission and dense component placement.
  • Suitable for sophisticated electronic systems.

Precision Lamination Registration Control

  • Fourteen core layers aligned with registration deviation ≤50μm.
  • Prevents blind-via and inner-layer target misalignment.
  • Ensures consistent electrical connectivity throughout the PCB.

First-Order HDI Technology (1+N+1)

  • Efficient blind-via interconnection structure.
  • Improves routing density without excessive manufacturing complexity.
  • Cost-effective solution for high-layer-count PCB designs.

Black Solder Mask Technology

  • Premium appearance for high-end electronic products.
  • Enhanced process control for fine-pitch circuitry.
  • Suitable for compact and aesthetically demanding applications.

Enhanced AOI Inspection System

  • UV-assisted optical inspection improves defect recognition.
  • Reduces false detection caused by low-contrast black solder mask surfaces.
  • Increases production quality and yield.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm