|
| Brand Name: | XSW PCB |
| Model Number: | XSWPCB |
| MOQ: | 1 |
| Price: | Negotiable |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
5G Communication Module OEM Circuit Boards PCB Assembly Processing is a high-performance PCB assembly solution specifically developed for 5G communication modules, wireless networking equipment, IoT devices, telecommunications infrastructure, and high-speed data transmission systems. Designed to meet the stringent requirements of modern 5G technology, this PCB assembly service delivers excellent signal integrity, controlled impedance, low transmission loss, and superior reliability for next-generation communication applications.
| Layer Count | 12-Layer |
| Material | FR4 |
| Board Thickness | 2.5 mm (Customizable) |
| Copper Thickness | 2/1/1/1/1/1/1/1/1/1/1/2 oz |
| Minimum Hole Size | 0.25 mm |
| Minimum Line Width | 0.25 mm |
| Minimum Line Spacing | 0.25 mm |
| Solder Mask Color | Green |
| Surface Finish | Lead-free soldering |
Product Description
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm |
<30mm: ±0.03mm 30~60mm: ±0.05mm |
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