Product Description

• Designed for 5G Optical Communication Modules
  • Optimized for high-speed optical transceivers, optical network equipment, data center communication systems, and telecom infrastructure.
  • Supports stable high-frequency signal transmission and long-term operational reliability.
• High-Precision 6-Layer PCB Construction
  • Interlayer registration controlled to ≤50μm for accurate multilayer alignment.
  • X-ray sampling inspection ensures consistent manufacturing quality.
  • Board warpage maintained at ≤0.3%, improving assembly accuracy and component reliability.
• Superior Drilling Quality
  • Drill burrs controlled to ≤5μm for clean hole edges.
  • Hole wall roughness maintained at ≤12μm, enhancing copper plating adhesion.
  • Backlight inspection rating reaches ≥9, ensuring excellent through-hole quality.
• Premium ENIG Surface Finish
  • Plasma cleaning process performed before immersion gold plating to improve coating adhesion and surface cleanliness.
  • Gold thickness controlled at 0.05–0.10μm for excellent solderability and contact performance.
  • Nickel layer phosphorus content maintained at 8–11%, ensuring stable metallurgical properties.

• Design Specifications