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5G Optical Module PCB
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Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer

Customizable 5G Optical Module PCB FR4 TG170 8 Layer PCB Manufacturer

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
8-Layer
Material:
FR4 TG170
Board Thickness:
0.8 Mm (Customizable)
Copper Thickness:
1/0.5/0.5/0.5/0.5/0.5/0.5/1 Oz
Surface Finish:
ENIG
Supply Ability:
1 Million Square feet/per month
Highlight:

5G Optical Module PCB FR4 TG170

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Customizable 5G Optical Module PCB

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FR4 TG170 8 Layer PCB Manufacturer

Product Description

Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170

 

The Customizable 5G Optical Module PCB 8-Layer FR4-Tg 170 is designed for high-speed optical communication systems, 5G network infrastructure, data centers, and optical transceiver applications. Manufactured with high-performance FR4-Tg 170 material, this multilayer PCB offers excellent thermal stability, dimensional consistency, and electrical reliability under demanding operating conditions.

The 8-layer stack-up structure provides optimized signal routing, controlled impedance, and enhanced electromagnetic compatibility, making it ideal for high-frequency and high-bandwidth applications. Engineered to support advanced optical modules and communication equipment, the PCB ensures low signal loss, stable data transmission, and long-term reliability.

 

Key Specifications
Layer Count 8-Layer
Material FR-4 TG170
Board Thickness 0.8 mm (Customizable)
Copper Thickness 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.075 mm
Minimum Line Spacing 0.075 mm
Solder Mask Color Green
Surface Finish   ENIG

 

Product Description

  • Optimized for 5G Optical Modules
    • Designed for high-speed optical transceivers and optical communication equipment.
    • Supports data rates required for next-generation 5G and data center applications.
  • Advanced 8-Layer PCB Structure
    • Provides dedicated signal, power, and ground layers for enhanced performance.
    • Improves signal routing efficiency and power integrity.
  • Excellent Signal Integrity
    • Controlled impedance routing minimizes signal loss and reflection.
    • Supports high-speed differential pair transmission and low-latency communication.
  • Low-Loss Material Compatibility
    • Available with high-frequency and low-Dk materials for superior electrical performance.
    • Reduces insertion loss in high-speed optical networking applications.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm