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8 Layer 5G Optical Module PCB Optical Transceiver PCB High Frequency PCB Manufacturer

Brand Name:	XSW PCB
Model Number:	XSWPCB
MOQ:	1
Price:	Negotiable
Payment Terms:	Western Union
Supply Ability:	1 Million Square feet/per month

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ,IOS9000

Layer Count:

8-Layer

Material:

FR4 TG150

Board Thickness:

1.0 Mm (Customizable)

Copper Thickness:

1/1/1/1/1/1/1/1 Oz

Surface Finish:

ENIG

Supply Ability:

1 Million Square feet/per month

Highlight:

8 Layer 5G Optical Module PCB

8 Layer Optical Transceiver PCB

5G High Frequency PCB Manufacturer

Product Description

5G Optical Module PCB Optical Transceiver PCB High-Frequency PCB Manufacturer

This 5G optical module features an 8-layer through-hole immersion gold plating with green solder mask, controlling glass cloth protrusion on the hole walls and preventing solder bridges from the green solder mask. Drilling employs a double-sided drilling process, ensuring no glass cloth protrusion on the hole walls, a roughness ≤10μm, and a backlight rating ≥9. The width of the green solder mask is ≥75μm, measured using 3D measurement after development, and then cured at 150℃ for 70min. Plasma cleaning is performed before immersion gold plating, resulting in a gold thickness of 0.05-0.10μm, no black pads in the nickel layer, and a salt spray test duration ≥96h. Ultrasonic scanning after thermal shock shows no delamination, and the copper elongation within the holes is ≥12%. Ion contamination is ≤0.3μg/cm², and each batch undergoes a 1000h CAF test for insulation resistance ≥10^9Ω. A dedicated 5G optical module QR code is laser-engraved on the board surface.

Key Specifications

Layer Count	8-Layer
Material	FR-4 TG150
Board Thickness	1.0 mm (Customizable)
Copper Thickness	1/1/1/1/1/1/1/1 oz
Minimum Hole Size	0.15 mm
Minimum Line Width	0.075 mm
Minimum Line Spacing	0.075 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

High-Reliability 8-Layer PCB Structure
- Designed for 5G optical communication modules requiring high-speed signal transmission and long-term operational stability.
- Multilayer stack-up enhances signal integrity and power distribution performance.
Advanced Through-Hole Quality Control
- Double-sided drilling process effectively eliminates glass fiber protrusion on hole walls.
- Hole wall roughness controlled to ≤10μm, improving plating uniformity and electrical reliability.
- Backlight inspection rating reaches ≥9, ensuring excellent drilling quality.
Optimized Green Solder Mask Process
- Green solder mask bridge width controlled at ≥75μm through 3D measurement verification after development.
- Prevents solder bridging and improves assembly yield for fine-pitch components.
- High-temperature curing at 150℃ for 70 minutes enhances adhesion and chemical resistance.
Premium ENIG Surface Finish
- Plasma cleaning before immersion gold plating improves surface cleanliness and coating adhesion.
- Gold thickness maintained at 0.05–0.10μm for excellent solderability and contact performance.
- No black pad defects in the nickel layer, ensuring high reliability for optical module applications.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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