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High Frequency Printed Circuit Board
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High Frequency Density 10 Layer HDI PCB Design For 5G Communication Equipment

High Frequency Density 10 Layer HDI PCB Design For 5G Communication Equipment

Brand Name: XSW PCB
Model Number: XSWPCB
MOQ: 1
Price: Negotiable
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Detail Information
Place of Origin:
China
Certification:
UL ,IOS9000
Layer Count:
10-Layer
Material:
Fr4 Tg170
Board Thickness:
1.5 Mm (Customizable)
Copper Thickness:
1/1/1/1/1/1/1/1/1/1 Oz
Surface Finish:
Lead-free Soldering
Supply Ability:
1 Million Square feet/per month
Highlight:

10 Layer HDI PCB Design

,

High Frequency HDI PCB Design

,

High Density HDI PCB Design

Product Description

HDI 10 Layer PCB Design High Frequency Density For 5G Communication Equipment

 

This 10-layer HDI PCB with ENIG surface finish is engineered for high-density and high-frequency circuits of 5G communication equipment. Adopting advanced HDI microvia technology, the board realizes fine circuit routing, compact component layout and effective miniaturization of communication modules. High-frequency optimized substrate guarantees superior signal integrity for RF and high-speed digital signals under 5G frequency bands. ENIG (Electroless Nickel Immersion Gold) treatment provides flat pad surface, excellent oxidation resistance and reliable soldering performance for BGA, QFN and mini semiconductor devices. Precise impedance control, stable layer alignment and low signal loss make this HDI multilayer board widely applied in 5G communication terminals, RF transceivers, communication gateway modules and wireless signal processing units.

Key Specifications
Layer Count 10-Layer
Material Fr4 Tg170
Board Thickness 1.5 mm (Customizable)
Copper Thickness 1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish   Lead-free soldering

 

Product Description

1.10-layer HDI multilayer structure with microvia technology, support fine line & high-density wiring
2.High-frequency material option available, effectively reduce RF signal attenuation for 5G application
3.Optimized for high-density component arrangement, help realize equipment lightweight and miniaturization
4.Accurate layer registration and reliable interlayer connection via blind & buried vias
5.Strict controlled impedance tolerance, maintain stable transmission of high-speed & RF signals
6.Outstanding solderability, perfectly compatible with fine-pitch BGA, microchip and SMT assembly
7.Low dielectric loss, less signal crosstalk in high-frequency working environment
8.Good thermal stability, withstand multiple SMT reflow soldering processes
9.Compliant with IPC manufacturing standards, stable performance for commercial 5G communication devices

  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm