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| Brand Name: | XSW PCB |
| Model Number: | XSW-HDI6AL |
| MOQ: | 1 Piece |
| Price: | Negotiable |
| Payment Terms: | T/T, Western Union, PayPal |
| Supply Ability: | 1 Million Square Feet per Month |
This 6-layer any-layer HDI PCB uses a full any-layer microvia structure for maximum routing density in miniaturized medical, wearable and RF modules. Precision laser drilling and fine-line imaging equipment are the core of the process, delivering 0.1mm microvias and 0.05mm traces with strict diameter and registration tolerances.
UV laser drilling machines form 0.1mm microvias with a diameter tolerance of +/-10um, controlling energy per pulse to prevent overcuts and barrel damage in the any-layer stack.
LDI equipment resolves 0.05mm line and space with +/-5um dynamic alignment, enabling high-density routing on every any-layer core.
Laser ablation depth is controlled to +/-15um so that each microvia stops precisely on the target pad without penetrating lower-layer copper.
Calibrated TDR equipment measures differential and single-ended impedance to +/-10%, safeguarding RF and high-speed links.
Fine-pitch flying probe testers with +/-10um probe positioning verify every net on 0.05mm features without physical fixture error.
| Layer Count | 6-Layer (any-layer HDI stack-up) |
| HDI Type | Any-layer microvia |
| Material | FR-4 High-Tg 170 |
| Board Thickness | 0.8 mm (Customizable 0.5-1.6 mm) |
| Copper Thickness | 1 oz (outer) / 0.5 oz (inner) |
| Min Line Width / Spacing | 0.05 mm / 0.05 mm |
| Min Laser Microvia | 0.1 mm (tolerance +/-10um) |
| Via Pad Pitch | 0.25 mm |
| Solder Mask | Black |
| Surface Finish | ENIG (Immersion Gold) |
| Any-Layer Stacking | Interconnect at any layer needs +/-10um via diameter and +/-15um ablation depth control on every core |
| Fine-Line Density | 0.05mm LDI imaging lets any-layer HDI pack high I/O under small footprints |
| ENIG Finish | Flat nickel-gold finish suits fine-pitch BGA and reliable wire bonding |
| Testing | Flying probe, impedance coupon, AOI and 100% electrical test |
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